The next four years will be critical for American industrial policy as Washington seeks to strengthen its position in global semiconductor fabrication. Building on the Trump administration’s efforts to reshore semiconductor design and manufacturing, policymakers and industry professionals will need to collaborate on a comprehensive plan to foster a robust semiconductor ecosystem in the United States.

Senior Fellow Jason Hsu will moderate a discussion with Taiwan Semiconductor Manufacturing Company (TSMC) Senior Vice President Peter Cleveland, ASML Head of US Government Affairs Jonathan Hoganson, Tokyo Electron Director of Government Affairs Paul Treadgold, and MediaTek Vice President of Government Relations Patrick Wilson. They will examine potential policy changes, structural challenges, and opportunities for the United States to leverage its partnerships and build a more sustainable domestic semiconductor ecosystem.