In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themselves. 

von Trapp and Drolz explore the evolution of inspection methods in advanced packaging, noting the complexity of 3D ICs and the limitations of traditional optical inspections. Drolz emphasizes the importance of AI in accelerating yield curves and improving inspection efficiency. She also mentions the need for an enterprise solution to integrate various inspection tools.

You’ll learn:

• About the difference between 2D and 3D X-ray technologies
• How 3D X-ray evolved over the past decade so that it can be used effectively in volume production
•  How Comet Yxlon’s CA 20 tool, integrated with the AI software Dragonfly, enhances defect detection by using deep learning to analyze X-ray images

Contact Isabella Drolz on LinkedIn

Comet Xylon
Comet Yxlon delivers high-end X-ray and CT system solutions for advanced packaging inspecton needs.

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