By Francoise von Trapp
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The podcast currently has 143 episodes available.
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In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?
In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like.
You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:
The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.
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· Monita Pau
· Jiangtao Hu
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In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024.
This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onshoring, keynote speakers by industry leaders, and much more. The symposium will also host a Bingo networking event to promote DEI, a career fair, student poster sessions, and off-site tours to MIT and MRSI Systems.
Listen in to learn about:
Register for this year's IMAPS Symposium here.
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In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it.
They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools that are still very much in need, and the impact this is having on device manufacturers that rely on legacy tools, but have trouble finding repair parts. This was part of an interview with Bruce by WorldFolio. Find the complete article here.
You’ll learn how SurplusGLOBAL is building a global parts platform that helps legacy tool owners find parts, and also manufactures replacement parts for those that have become obsolete. You’ll also learn how AI is helping to optimize this business. You’ll also hear about the 2030 Big Cluster Project, the company’s global expansion in semiconductor manufacturing hot spots around the globe, and more.
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In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.
The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties.
You’ll learn about:
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This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development. Today’s guests will address both these topics.
Paul Kelly, Vice President of Strategies, Partnerships, & New Ventures and Chief Operating Officer of NY CREATES, and Dr. Mousumi Bhat, SEMI Vice President of Sustainability Programs join Françoise von Trapp to discuss an environmental sustainability partnership between NY CREATES and the SEMI Climate Consortium (SCC). You'll learn:
Our second guest is Shari Liss, Director of SEMI Foundation. She updates Françoise on the initiatives her team launched in the U.S. to address the semiconductor talent shortage, and how they are being rolled out in other parts of the globe.
Connect with our guests on LinkedIn:
SEMI
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For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors.
She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized. It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies.
You'll learn:
Françoise also takes you on an audio tour of the facility, led by Operations Director, Carl Petteway. It gets a bit noisy - but you'll feel like you're right there, and you'll learn about the tools used to perform processes like chemical mechanical polishing (CMP), photolithography, hybrid bonding, and through silicon vias.
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Learn More:
Read the story and see the photos from the tour on the 3D InCites Website.
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The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows.
The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit a fab with its highly calibrated, sensitive equipment? There are many moving parts to consider – both figuratively and literally.
In this episode, Françoise von Trapp leads a conversation with Barry O’Dowd of Kuehne+Nagel; Kevin Mille, of KLA, and Emerald Grieg, of PTW Group to discuss what it takes to successfully move a piece of semiconductor equipment from the supplier to the manufacturer.
The speakers discuss trade compliance and logistics challenges, the proper approach to packing and crating sensitive equipment, and how to ensure safe transportation. They discuss the differences between moving new equipment from an OEM, and secondary equipment from a broker. They also share stories of when things didn’t go exactly to plan, and what they learned from the experience.
Listen in and learn:
Contact Our Panel on LinkedIn:
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This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers to connect dies without pads, and the ongoing talent crisis in the industry. They also highlighted the importance of sustainability and the potential for the industry to reach a trillion-dollar goal by 2030. Additionally, speakers discussed the expansion of companies in North America, the significance of UV laser debonding, and the investment in electric vehicles and carbon initiatives.
Speakers include:
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Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology.
This episode features Françoise von Trapp’s conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Department of State, to talk about securing critical supply chains for the 21st century.
Fernandez discussed the importance of addressing geopolitical issues and ensuring supply chain resilience, particularly in the aftermath of the pandemic. He highlighted the importance of establishing global semiconductor supply chains that meet clean energy goals to galvanize a clean energy future. He also emphasized the need to prioritize security over efficiency and highlighted the issue of semiconductors seeping into Russia despite sanctions.
You’ll also learn:
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
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Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies.
Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and Science Act, implementation updates, and government investments in semiconductor manufacturing and supply chain.
Key takeaways included the importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.
You’ll learn about:
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The podcast currently has 143 episodes available.
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