This episode features interviews that were recorded live at IMAPS DPC 2023.  

 First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk.

Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used. 

 Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.

Episode Guests

·      Sylvie Joly, CEA-Leti

·      Basam Ziadeh, General Motors

·      Nicholas Harris, Lightmatter

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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