Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.

• Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall"
• Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption
• Thermal challenges multiply in 3D stacks as power density doubles with each added layer
• Data centers projected to consume 10% of US electricity by 2030, making power efficiency critical
• Siemens working to standardize design languages across tools and enable open chiplet ecosystems
• Average age of electrical engineers in US is 57, creating urgent need for workforce development
• Universal Chiplet Interconnect Express (UCIe) emerging as key standard for chiplet interoperability

Visit siemens.com/3DIC to learn more about Siemens' comprehensive 3DIC solutions.

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