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Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). 

Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format and increasing the exhibition space helped organizers achieve record attendance. They also describe the volunteering opportunities and the pathway to leadership it provides. They shared their own experiences and the impact ECTC has had on their careers. 

From the event itself, you'll learn about the importance of packaging technology and collaboration between chip and packaging communities to meet the high bandwidth requirements of AI applications. You'll also learn about advancements in hybrid bonding, metrology, and the impact of geopolitics in electronics packaging.

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