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This episode was recorded live at the 2023 IMAPS International Symposium, where the week’s keynote talks focused on different aspects of heterogeneous integration, packaging technology for high-performance computing, and what’s driving these technologies. Françoise von Trapp speaks with three of the keynote speakers who addressed attendees including Kevin Anderson, of Qorvo; Jeffrey Burns, of IBM Research; and C.P. Hung of ASE Group. 

From Kevin Anderson, you’ll hear about Qorvo’s involvement in DARPA’s SHIP Program, and its Advanced State-of-the-Art RF Semiconductor Packaging Center that won them the 2023 3D InCites Award for Device Manufacturer of the Year. You’ll get Qorvo’s back story in being a supplier of wireless products and its focus on compound semiconductors. You’ll also learn about the difference between the SHIP Program and the CHIPS for America Act, and the role Qorvo plays. 

From Jeff Burns, you’ll get detailed education on AI, and Deep Learning. Using the development of image recognition as an example of how AI can surpass human capabilities, he explains the advantages of AI accelerators, and how IBM’s work in foundation models is democratizing AI applications. He also explains the role 3D heterogeneous integration and chiplet architectures in making this happen. 

From CP Hung, you’ll get a history lesson on the different types of advanced packages that are available to solve different challenges presented by today’s applications.  Specifically, you’ll learn about the needs of Electric Vehicles, and how heterogeneous integration is addressing these needs. You’ll also learn about ASE’s launch of its  Integrated Design Ecosystem (IDE)  a collaborative design toolset optimized to systematically boost advanced package architecture across the VIPack™ platform. 

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IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

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