This week’s episode dives deep into the world of X-ray inspection and its many uses in today’s high-density 3D heterogeneous integration technologies for semiconductor manufacturing. Françoise von Trapp speaks with subject matter expert, Chris Rand, of Nordson Test and Inspection. 

 You’ll learn the basics – how X-ray inspection is used in semiconductor manufacturing and how that has changed over the years. The challenges facing manufacturers as heterogeneous integration schemes become more advanced – with 3D stacking and chiplet architectures are also discussed.

You’ll also learn why achieving zero defects is so important for today’s semiconductor and microelectronics devices and the different strategies for achieving zero defects.  

 Lastly, you’ll learn about some solutions provided by Nordson Test and Inspections to help you execute those zero-defect strategies.

You can learn more about the new Quadra Pro at the Nordson Test & Inspection website. 

Contact Our Guest on LinkedIN

• Christopher Rand, Product Line Manager at Nordson Test and Inspection

Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show