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Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems
Learn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
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Send us a text
Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems
Learn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
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