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This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023. 

The topic of the week was Shaping a Sustainable $1 Trillion Era. Members weigh in on what their companies are doing to support this effort. They also discuss their impression of the show, what they were showcasing, and their latest news. 

Peter Dijkstra, Trymax Semiconductor, updates us on activities at Trymax USA and shares news of his participation at a Dutch and Flemish delegation in Phoenix Arizona in early December. 

Mike Motherway, Cimetrix by PDF Solutions, talks about the role cloud-native data tools for AI applications play in global fab expansion. 


Debbie Claire Sanchez at ERS Electronic explains the company’s partnership with PulseForge to bring photonic debonding to their product portfolio as an equipment integrator of this technology. 

David Wang and Jim Straus of ACM Research share the news of the company’s expansions in Asia as well as the Grand Opening of its new office in Portland, Oregon.

 Hans Peters and Emerald Grieg, PTW Group,  introduce a new tool line, SpinTec, established to renew and restore legacy SEZ single wet wafer tools. 

 Abul Lateef, PlasmaTherm, talks about the company’s latest acquisition of Milan-based Thin Film Equipment, to complete PlasmaTherm’s sputtering and PVD portfolio, and put them near significant customers in Italy. 

 Neil O’Brien, Finetech, talks about the growing need for high-accuracy die-bonders, and how that’s driving a need for full production tool

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