This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. 

 Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law. 

You’ll learn about: 

• Chiplets architectures for high-performance applications 
• How chiplets can enable foundational AI models that can be applied to various business use cases
•  Challenges in chiplet design and test 
• The importance of open interface standards 

Contact our guests on LinkedIn:

• Arvind Kumar, IBM
•  Hemanth Dhavaleswarapu, AMD
•  Pooya Tadeyon, Intel  

Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry. 

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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