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Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.

Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.

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IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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