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Adhesive Lets 3-D Microchips Go Deep
IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports
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By Scientific American
4.2
5959 ratings
IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports
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