In this episode of Embedded Edge, our guest is Richard Jaenicke, director of marketing for safety- and security-critical products at Green Hills Software. With over 25 years of experience in embedded systems, Richard discusses Green Hills’ contributions to safety and security in industries such as aerospace, defense, automotive, and medical. The conversation dives into the company’s Integrity-178 real-time operating system, which ensures both safety and security for critical systems, as well as the company’s future goals in enhancing embedded system integrity across various sectors.

Embedded antennas are crucial components in modern wireless communication systems, enabling seamless connectivity in a wide range of applications, from IoT devices to automotive systems. In this episode, we’ll uncover the design principles, material choices, and integration challenges that define the performance and reliability of these antennas. Our guest is Dermot O’Shea, CEO and co-founder of Taoglas. Dermot has been working in the global electronics industry since 1997. A graduate of University College Dublin, Dermot has also completed graduate courses in business, computing and enterprise development from Dublin Business School, Griffith College, and Waterford Institute of IT, respectively.

In this episode of Embedded Edge, we explore how AI-native technologies are revolutionizing wireless systems. Our guest, Houman Zarrinkoub, principal product manager for wireless communications at MathWorks, discusses the importance of AI in advancing 5G and 6G standards, the benefits over traditional models, and the future potential of digital twins in wireless communication.

Nitin Dahad sits down with Sam Geha is the Executive Vice President of the IoT, Compute and Wireless Business at Infineon Technologies to discuss how AI is going to transform IoT at the edge.

In this episode of Embedded Edge, we’re thrilled to be joined by Michael Förtsch, CEO of Q.ANT, a pioneering company at the forefront of photonic computing. With a focus on using light instead of electricity, Q.ANT’s innovation promises not just higher computational density but also a dramatic reduction in energy consumption. Today, we’ll dive into the fundamental differences between traditional silicon-based systems and photonic computing, the potential of thin-film lithium niobate in this revolution and the broader impact on industries.

Infineon's VP Sivaram Trikutam and Nitin Dahad explore new insights in IoT landscape as the use of Wi-Fi 6/6E expands and why it serves as the foundation for current and next-generation IoT designs. We'll discuss technology trends, typical applications, future predictions and how Wi-Fi 6/6E will make our lives and IoT devices more convenient and energy efficient. 

In this episode, François Baldassari from Memfault explains the concept of observability and why he believes there’s a reliability crisis in today’s embedded software. He does this in the context of changing business models for IoT deployments, from selling devices to selling solutions as a service, and why that requires vendors to identify issues in the field before the customer does. He also talks about why today’s IoT developers need to consider the benefits of open source or third-party software vs build-your-own software, and how Memfault’s blended approach offers a strategic advantage as part of an integrated software quality strategy.

In this embedded edge podcast, we address some of the likely causes and implications of the recent global IT outage caused by a Crowdstrike software update for Microsoft operating system-based devices. 

In this podcast, we talk focus on security, talking to Infineon Technologies about the Cyber Resilience Act (CRA) and its implications for the entire supply chain, plus a chat with zeroRISC about the role of open-source silicon security in embedded systems and IoT.

We are currently experiencing a significant turning point in the semiconductor industry, marked by the rapid adoption of heterogeneous integration of dies into a single package. This new architecture presents unique challenges and demands. However, one thing is certain: the industry needs an interconnect that quickly and reliably links the dies. The Universal Chiplet Interconnect Express (UCIe) has emerged as the leading standard for die-to-die connectivity due to its flexibility, comprehensive stack support, and technical strengths. This podcast delves into the UCIe standard, describing the challenges it helps designers tackle, some of the progress since its inception, and ways to maximize UCIe beyond the standard’s definition. We will also explain how to best utilize UCIe to cater to your specific application needs.