Anda Technologies launched the iCoat 5L, a large format conformal coating system that accommodate up to 600mm in width and any length of board. It has 5 axis of movement and can be fitted with an array of different valve configurations.

Anda also supply two different forms of plasma technology and a range of different curing options.

MIRTEC showed the 5 camera ART 3D AOI system for inspection small, shiny devices. The system merges the raw data from all five cameras to provide more accurate inspection without losing any data.

MIRTEC also showed the TAL Component inspection unit that uses a laser-based head to measure components up to 70mm in height. The unite works in tandem with MIRTEC's MV6 OMNI which maintains line speed.

Europlacer shows it's latest iiP7 stencil printer and the iiN2 pick and place machine.

The printer is fitted with a unique lookup/look down camera below the stencil and above the stencil. The printer scan the PCB fiducials after it enter the work area. The stencil then pulls out to allow the top camera to calibrate the PCB in the print position. The printer has a maximum cycle time of 5 seconds.

Other features include the ability to dispense paste or glue and apply a barcode at the end of the cycle.

The iiN2 is the latest iteration to the inneo family of pick and place machines. Designed to handle a much wider range of components, faster changeover and increased productivity.

Apollo Seiko introduced a new inductance-based soldering system. It is built on a 3-axis robot, using a pendant tablet to program the system. The company also manufactures a wide range of laser soldering systems. The latest Stargate system is fitted with a pyrometer that ensures the core temperature on the circuit board stays within spec.

The NXTR was originally introduced two years ago. FUJI have made a number of refinements to improve changeover times.

FUJI have also introduced an automated printer system at the start of the line.

Another new launch at APEX is the AIMEXR platform that uses a smaller number of heads to handle a larger range of components for processing large boards and tall devices.

The latest version of the Essegi 3600 FA storage tower has been reconfigured to increase the automation for loading and unloading. The access door has been moved from the rear of the machine to the front side for easier access by AVGs.

StenTech introduced a new nano coating for stencils called StenTech Blueprint. The coating is only 2 nanometeres thick and is applied through an ion deposition sputtering technique to provide superior protection to the stencil.

DuPont showcased a range of flexible and durable materials used in PCB manufacturing.

Transition Automation have upgraded the design of the magnetic squeegee blade system introduced last year. The magnetic force has been softened across the length of the blade and the end stops made simpler and easier to attach and remove for cleaning.

The ViTtrox V810 provides 100 percent board inspection at line speed. Richard describes how they are using AI to improve programming time, defect classification and identification. this is contributing to an overall saving of up to 30 percent.