Pat Hindle and Eric Higham talk with Juan Montojo, Vice President of Engineering at Qualcomm’s Corporate Standards group and the global lead of 3GPP standardization at Qualcomm, about Qualcomm's recent plans and key projects to build on the foundation of 5G Advanced and lay the track for the path to 6G, through the 3GPP Work and Study Items of Release 19.

Pat Hindle talks with Paul Head, director of Next Generation Technologies, Advanced Technology at Raytheon, about their recent contract win to build high power microwave systems for U.S. military and the successful demonstration the Counter-Electronic High-Power Microwave Extended-Range Air Base Defense system (CHIMERA).

Microwave Journal editors Pat Hindle and Eric Higham review the products in the Jan Radar and Antennas issue, new Qorvo IoT video, industry news and events. Sponsored by RFMW and Qorvo.

Pat Hindle talks with Gianluca Redolfi, CCO at Sateliot, about the upcoming explosion of NB-IoT NTN devices coming to the market this year for various applications from tracking cattle to monitoring water and the electric grid.

Microwave Journal editors Pat Hindle and Eric Higham cover the Jan Radar and Antenna themed issue technical articles, industry news and events. Sponsored by RFMW.

Jin Bains, CEO of Mini-Circuits, talks with Pat Hindle, Media Director at Microwave Journal, about his history with the company, key product technologies and areas of growth for the company. Sponsored by Mini-Circuits.

In the first ever AI Holiday episode, Microwave Journal editors Pat Hindle and Eric Higham with special guest, Jin Bains, CEO of Mini-Circuits, elf themselves in an all AI generated amination, discuss the Dec issue products, interview Jin, and exchange AI generated gifts. Sponsored by Mini-Circuits.

Hosts Bryan Goldstein, President- Analog Devices Federal and Vice President Aerospace and Defense Group at Analog Devices, and Sean Darcy, Sr. Director Aerospace and Defense at Infineon talk with special guest, John Park, Product Management Group Director for IC packaging and cross-platform solutions at Cadence Design Systems, about the challenges of heterogeneous integration, how it compares to SoC and 3D packaging, and the future of this technology for the semiconductor industry. Visit Analog Devices A&D webpage for solutions to your design challenges.

Pat Hindle talks with Matt Tyhach, Mission Area Director for Next Gen Sensors and Microelectronics in Advanced Technology at Raytheon, about recently awarded a four-year, $15 million contract from DARPA to increase the electronic capability of RF sensors with high-power-density GaN transistors with 16X output power compared to traditional devices. This will enable future "smart" systems that can meet the needs for radar, EW and communications with one system.

Dan Ford, Product Line Engineering Manager from Mini-Circuits’ High-Frequency Product line out of their Deer Park Technology Center talks with Pat Hindle about mmWave products, trends and new features being designed into Mini-Circuits' products. Sponsored by Mini-Circuits.