Microwave Journal editors Pat Hindle and Eric Higham celebrate the 250th episode of Frequency Matters plus review the products in the April Amplifiers and Oscillators themed issue, industry news and events. Sponsored by RFMW.

Microwave Journal editors Pat Hindle and Eric Higham cover the April Amplifiers and Oscillators themed issue technical articles, industry news and events. Sponsored by RFMW.

Pat Hindle and Eric Higham talk with Ryan Pratt, Founder and CEO at Guerrilla RF about the history of the company, its growth over the years and outlook for the industry.

Tzeno Galchev, Marketing Director for the MEMS Inertial Sensor Group at Analog Devices, discusses how MEMS and IMUs can be used in steering microwave systems and the future of this technology. Check out ADI IMUs at https://www.analog.com/en/product-category/inertial-measurement-units.html. Sponsored by Analog Devices.

Microwave Journal editors Pat Hindle and Eric Higham cover the March Cable and Connector special focus articles, interview ADI's Tzeno Galchev about IMUs for microwave applications, industry news and Satellite 2024 event. Sponsored by RFMW and Analog Devices.

Microwave Journal editors Pat Hindle and Eric Higham review the articles in the March Test and Measurement themed issue, show automatic fixture removal software demo and review the latest industry news and events. Sponsored by RFMW and Copper Mountain Technologies.

Darren McCarthy, Aerospace & Defense Industry Segment Manager at Rohde & Schwarz, talks with Pat Hindle and Eric Higham about mmWave security scanning systems, their deployment outlook and the future of security scanning in various applications.

Microwave Journal editors Pat Hindle and Eric Higham discuss the Feb Satellite and Radio Communications issue products, industry news and events. Sponsored by RFMW.

Microwave Journal editors Pat Hindle and Eric Higham discuss the technical articles in the Feb Satellite and Radio Communications themed issue, industry news/mergers and events. Sponsored by RFMW.

Pat Hindle and Eric Higham talk with Juan Montojo, Vice President of Engineering at Qualcomm’s Corporate Standards group and the global lead of 3GPP standardization at Qualcomm, about Qualcomm's recent plans and key projects to build on the foundation of 5G Advanced and lay the track for the path to 6G, through the 3GPP Work and Study Items of Release 19.