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Françoise von Trapp talks to SEMI President and CEO Ajit Manocha, about the semiconductor industry’s journey on the path to becoming a $1 Trillion and what SEMI is doing to address the headwinds that could prevent that from happening. 

The semiconductor industry is growing at an amazing rate as demand for computer chips increases in everything from traditional applications like high-performance computing, data centers, and network architectures to automotive, artificial intelligence, and machine learning applications. Experts anticipate the industry will become a $1T industry by the 2030s. But headwinds including supply chain disruptions, the impending restrictions on PFAS chemicals that are used in semiconductor manufacturing, and the growing talent shortage will cause delays. 

From this exclusive interview with Ajit Manocha, you’ll learn why these headwinds threaten growth and SEMI’s efforts in addressing them. 

Contact Ajit Manocha on LinkedIn.

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At SEMICON West, one of the key areas of discussion was the Path to Net Zero. What can we do to make sure the semiconductor industry grows in a way that is beneficial to the planet and shows cross-industry leadership? 

Françoise von Trapp talks to SEMI’s Dr. Mousumi Bhat, VP of Global Sustainability Programs, and Collin O’Mara, CEO of the National Wildlife Federation about key takeaways from the sessions at the Climate Equity & Social Impact Pavilion at SEMICON West.

The program brought together leading climate and climate justice experts from across the United States, federal agencies like US EPA and the newly established Chips for America office, a White House advisor, and many SEMI member companies such as Lam Research, ASML, Western Digital, and TEL. 

O’Mara talks about why the CEO of the NWF is at SEMICON West, and the opportunities he sees for the semiconductor industry to address the climate crisis.

Bhat explains how the Climate Equity Pavilion relates to SEMI’s global work to help the industry collaborate for net zero through the Semiconductor Climate Consortium and other efforts. She also explains the importance of collaboration across the value chain to achieving Net Zero Goals, and what the industry is doing now to accelerate progress.

Learn more about SEMI's Semiconductor Climate Consortium. 

 Connect with our Guests on LinkedIN

 Dr. Mousumi Bhat, VP of Global Sustainability Programs

Collin O’Mara, CEO of the National Wildlife Federation

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In this episode, Françoise von Trapp talks with SEMI’s Bettina Weiss, and Bindiya Vakil, of Resilinc about how to navigate the complexities of the semiconductor supply chain. 

The electronics industry continues to be in a state of flux. After two years of shortages, delays, and skyrocketing costs, the causes of supply chain disruptions keep changing rapidly. There is no single cause. Economic uncertainty, legislation, geopolitics, sustainability, and regionalization are all at play. Supply chain managers must be ready for multiple worst-case scenarios and be able to pivot quickly when disruption hits. Agility is the name of the game and companies must act quickly to changing needs. 

The conversation focuses on why we’re still struggling with supply chain issues after 2 years, and how these disruptions are likely here to stay. The connection between supply chain issues and sustainability is also examined. 

You’ll learn why traditional approaches are no longer the best way to go, and how you can set your company up for supply chain success. Lastly, you’ll learn about the SEMI Supply Chain Management Initiative, led by an Industry Advisory Council that now includes ASE, ASM, Dell, GlobalFoundries, Google, Infineon, Intel, KLA, Merck, Schneider Electric, and TSMC.

To hear more from Bindiya Vakil, listen to the 2022 podcast episode from SEMI ISS 2022: A Conversation about Creating a Risk-Ready Supply Chain.  

Connect with our Guests on LinkedIn

•  Bettina Weiss, Chief of Staff and Corporate Strategy, SEMI
• Bindiya Vakil, CEO and Founder, Reslinc

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For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode,  Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges in 3D.  Industry experts Raja Swaminathan, of AMD; Andre Blum, of Audi; and Eric Beyne, imec lend their voices to the conversation. 

The panel address the main drivers for 3D in different applications spaces. They also discuss the importance of partnerships and collaboration to implement heterogeneous integration solutions. There is a focus on evolving automotive electronics, and how 3D integration technologies are coming into their own to provide solutions as more advanced technology is needed alongside legacy node products. 

Find the Panelists on LinkedIn

·      Moderator – Jan Vardaman, Techsearch International

·      Raja Swaminathan, AMD

·      Andre Blum, Audi

·      Eric Beyne, imec 

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Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization. 

The specific technology focus is on plasma dicing, its uses, particularly in die-to-wafer hybrid bonding, and the path to adoption. Thomas addresses in detail some of the process challenges and how SPTS has addressed them. He also talks about the fast-moving technical requirements that make the processes for packaging applications highly competitive. 

To learn more about plasma dicing, read this article published by KLA on 3D InCites. 

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In this special episode of the 3D InCites Podcast, in partnership with the International Microelectronics and Packaging Society (IMAPS), we talk to Steve Kummerl,TI; and Mark Gerber, ASE, about the upcoming CHIPcon event which takes place July 24-27 in San Jose CA. This conference is a rebrand and restructuring of what was formerly the Advanced System in Packaging Symposium. Kummerl is the General Chair for the event, and Gerber is on the IMAPS Academic Committee. They are part of the team that put together a very robust agenda, with expert speakers from across the chiplet ecosystem. 

 CHIPCon stands for Chiplet Heterogeneous Integration and Packaging Conference. Kummerl and Gerber talk about the motivation for repositioning the conference, and how the speakers were selected to represent the end-to-end chiplet ecosystem. They also explain how CHIPCon is differentiated from the annual IMAPS International Device Packaging Conference. They provide some details of what attendees can expect to learn by attending this event. 

Note that Early Bird Registration AND the hotel block ends today, June 30, 2023. Registration for both is found at www.chipcon.org. 

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This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! 

 At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.   

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.  

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer. 

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both. 

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding. 

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding. 

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA. 

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In this SEMICON West podcast preview episode, Françoise talks with SkyWater’s CEO Tom Sonderman, who will deliver a keynote talk, “Creating a Path to Talent”. addressing the workforce shortage currently facing the semiconductor industry.

Semiconductor manufacturing is on a path to becoming a $1Trillion industry somewhere around 2030. New fabs are being constructed all over the world to meet the growing demand for computer chips. In the US, the CHIPS and Science Act legislation and the promise of a $52B investment to fuel onshore manufacturing is driving this growth. One of the many challenges is building the workforce to support this flourishing industry.  

Sonderman provides the back story on how the US semiconductor industry got into this talent crisis and what can be done about it.  He gives a glimpse of some of the programs launched at SkyWater to provide pathways for recruitment, to fill critical roles from fab technicians to Ph.Ds. 

You can catch the full Keynote talk during the CEO Summit Keynote session, The Path to Talent, which takes place on Thursday, July 13  at  SEMICON West.  SkyWater is also working with the SEMI Foundation on workforce development programs. Check out all the CEO Summit Keynotes here.

Connect with Tom Sonderman on LinkedIn. 

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The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals. 

Rozalia Beica and Venkata Mokkapati, AT&S talk about the important role advanced IC substrates have in today’s advanced microelectronics. They addressed questions about the lack of IC substrate manufacturing in the US, and how AT&S is positioned to help support that need. 

Ram Trichur, of Henkel Corporation accepted the Material Supplier of the Year 3D InCites Award and talked about changing materials requirements to support automotive electronics requirements. 

Ralph Zorberbier and Rolland Rettenmeier of Evatec talk about advancements in physical vapor deposition for fan-out wafer-level packaging, and thermal management solutions for HPC. They also talk about the traction fan-out panel level packaging is getting. 

David Levy, of Mosaic Microsystems, was at ECTC to learn about emerging applications that could benefit from the company’s thin glass handling solutions. 

 Stephan Schmidt, LPKF Laser, explains why glass is such an important topic right now in the microelectronics community and the role LPKF has played in solving glass challenges – such as forming through glass vias. 

Irving Wang, MRSI, talks about what he came to learn at ECTC 2023, and the current focus on hybrid bonding, and the role MRSI plays in die-to-wafer hybrid bonding. 

Garry Pycroft, Deca, sings the praises of ECTC, and what a great event it is. He also talks about the different segments of the market that Deca’s technologies serves. 

Curtis Zwenger, at Amkor Technology, shares the news about opening of the smartest OSAT factory in the OSAT world, located in Vietnam.  

Dave Thomas, KLA’s SPTS division, talks about all the information he gets out of ECTC, and how it relates to what SPTS is working on to support emerging technologies. 

 C.P. Hong and Vikas Gupta, from ASE Group, talk about the company’s new product announcement, FoCoS Bridge, and how it fits into the VIPack pillars. 

Debbie-Claire Sanchez, ERS Electronic, talks about the company’s efforts to build a p

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In this episode, recorded live at ECTC 2023, Françoise interviews some of the key speakers about the hot topics of the week: Quantum computing, the Chips and Science Act, and workforce development. Additionally, she speaks with the winner of the first-ever, IEEE EPS William Chen Distinguished Service Award. The episode concludes with a conversation with the event organizers about changes and future plans. 

Keynote speaker, Mike Manfra, physics professor at Purdue University, and Scientific Director, Microsoft Quantum Lab West Lafayette, talks about quantum computing — what it is, why we need it, and what challenges and opportunities exist from the microelectronics advanced packaging community to bring it into manufacturing.  

Dick Otte, Promex, and Joshua Dillon, Marvell, talk about the key takeaways from the Chips Act Special Session – Advanced Packaging in North America, building the ecosystem. 

Kim Yess, Brewer Science, talks about the Diversity and Career Growth Panel, and the key takeaways discussed by the panel on diversifying our workforce to meet National needs as outlined by the CHIPS Act Initiative. 

Shaw Fong Wong talks about what inspires him to volunteer his time to the EPS Society. 

 Ibrahim Guven and Florian Herrault wrap up the episode with a look at the success of this year’s format changes and future plans for ECTC 2024 and beyond. 

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