Hosts Bryan Goldstein, President- Analog Devices Federal and Vice President Aerospace and Defense Group at Analog Devices, and Sean Darcy, Sr. Director Aerospace and Defense at Infineon talk with special guest, John Park, Product Management Group Director for IC packaging and cross-platform solutions at Cadence Design Systems, about the challenges of heterogeneous integration, how it compares to SoC and 3D packaging, and the future of this technology for the semiconductor industry. Visit Analog Devices A&D webpage for solutions to your design challenges.