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Episode 38: The Future of Transistor Design and Advanced Packaging
Ben Bajarin is joined by guest Huiming Bu from IBM Research to discuss the future of the transistor (design) and advanced packaging. They also discuss some of the larger technology challenges facing the semiconductor industry in the years to come.
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By Ben Bajarin and Jay Goldberg
4.7
3838 ratings
Ben Bajarin is joined by guest Huiming Bu from IBM Research to discuss the future of the transistor (design) and advanced packaging. They also discuss some of the larger technology challenges facing the semiconductor industry in the years to come.
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