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In this episode of ACMByteCast, Bruke Kifle hosts H.-S. Philip Wong, the Willard R. and Inez Kerr Bell Professor of Electrical Engineering in the School of Engineering at Stanford University. He is also Chief Scientist of the Taiwan Semiconductor Manufacturing Company (TSMC), where he was previously Vice President of Corporate Research. His works have contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. Philip’s current research covers a broad range of topics including carbon electronics, 2D layered materials, wireless implantable biosensors, directed self-assembly, device modeling, brain-inspired computing, non-volatile memory, and 3D system integration. He is an IEEE Fellow and has received numerous awards, including the J.J. Ebers Award, the IEEE Electron Devices Society’s highest honor recognizing outstanding technical contributions to the field of electron devices that have made a lasting impact.
Philip starts by sharing how he entered the field of electrical engineering, fueled by an interest in science and physics. He talks about the key challenges of scaling down technologies and what he believes will be the next major technological breakthrough, which will create exciting opportunities for those just joining the industry. He discusses the potential of drawing inspiration from biological systems in designing better computing systems and developments in non-volatile memory. Philip also talks about exploring the practical applications of technology in his roles as Faculty Director for Stanford’s NanoFab Lab and Stanford SystemX Alliance, as well as at TSMC. Finally, he offers advice for aspiring engineers and touches on the ethical and environmental implications of some of the biggest emerging trends.
By Association for Computing Machinery (ACM)4.6
2424 ratings
In this episode of ACMByteCast, Bruke Kifle hosts H.-S. Philip Wong, the Willard R. and Inez Kerr Bell Professor of Electrical Engineering in the School of Engineering at Stanford University. He is also Chief Scientist of the Taiwan Semiconductor Manufacturing Company (TSMC), where he was previously Vice President of Corporate Research. His works have contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. Philip’s current research covers a broad range of topics including carbon electronics, 2D layered materials, wireless implantable biosensors, directed self-assembly, device modeling, brain-inspired computing, non-volatile memory, and 3D system integration. He is an IEEE Fellow and has received numerous awards, including the J.J. Ebers Award, the IEEE Electron Devices Society’s highest honor recognizing outstanding technical contributions to the field of electron devices that have made a lasting impact.
Philip starts by sharing how he entered the field of electrical engineering, fueled by an interest in science and physics. He talks about the key challenges of scaling down technologies and what he believes will be the next major technological breakthrough, which will create exciting opportunities for those just joining the industry. He discusses the potential of drawing inspiration from biological systems in designing better computing systems and developments in non-volatile memory. Philip also talks about exploring the practical applications of technology in his roles as Faculty Director for Stanford’s NanoFab Lab and Stanford SystemX Alliance, as well as at TSMC. Finally, he offers advice for aspiring engineers and touches on the ethical and environmental implications of some of the biggest emerging trends.

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