Our guest Phil Marcoux is very well-known in the advanced electronic packaging community and currently working as a business mentor in the electronics industry. 

Phil is labeled as the father of SMT by the IPC. He is a Charter member of SMT Council, granted the IPC President's Award, past owner of over 40 integrated circuit packaging and camera module-related patents, and consultant on numerous heterogeneous designs and standards, just to name a few of his excellent achievements.

Today we will tackle the pros and cons of heterogeneous electronic assemblies and what we can do as an industry to move forward with it.

Show Highlights:

• Learn about Phil Marcoux and his upcoming panel discussion at PCB West 

• The panel will discuss “How Heterogeneous Integration Affects the PCB Industry.”

• One of the challenges is to encourage companies to work together and to agree to a standardized chiplet format

• Other significant drivers in the market include medical devices, telecommunications, and 5G products

• PCB designers can very quickly jump in. Many structures in a printed circuit board, especially in HDI designs, are also used in advanced packages.

Links and Resources:

• Follow Phil Marcoux on LinkedIn