Advanced Packaging has been the talk of the town. Ever since people have identified it as a roadblock in Nvidia's AI chip production, and thus its stock price. TSMC has accelerated construction on several Advanced Packaging fabs across Taiwan to unblock this plug. At the same time, they and the rest of the industry are moving forward on an interesting technology that not only cuts costs but also sounds cool. The most intriguing theme of the 2024 SEMICON show in Taipei? Panels. Chips on panels. In this video, we are going to talk about this thing on the semiconductor horizon.