The equipment that fills data centers is evolving rapidly, driven by the need to fulfill the seemingly insatiable appetite of AI applications. The Open Compute Project (OCP) was founded by Meta/Facebook to promulgate equipment standards and its annual Summit has grown from a small specialized gathering, to an event that strains the capacity of the San Jose Convention Center. Senior research analyst Perkins Liu returns to offer his take on this meteoric growth with host Eric Hanselman. AI requirements are pushing ever greater scale both logically and physically, with the width of server racks doubling in the Open Rack Wide (ORW) specification to support greater density and better serviceability. The OCP Foundation is also working on silicon interoperability and is setting specifications for chiplet integration. Liquid cooling has moved from a nice to have feature to a required capability as a means to dissipate the huge amount of energy drawn by ever denser GPU arrays. Energy delivery is changing with the advent of higher voltage DC power. The early OCP efforts on 48 volt DC are paling in the face of new 800 volts designs.

The OCP Foundation is also expanding its mission to include education, with the establishment of the OCP Academy. It aims to raise workforce skills in open hardware and will offer online training in data center technologies. That underscores not only the expansion of the OCP Foundation's mission, but also the increasing scale of the ecosystem that supports data center environments and complexity and interdependency that AI creates.

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Credits:

• Host/Author: Eric Hanselman
• Guest: Perkins Liu
• Producer/Editor: Feranmi Adeoshun
• Published With Assistance From: Sophie Carr, Kyra Smith