The semiconductor industry is undergoing a shift with the rapid adoption of multi-die design, driven by the promise of improved power, performance, and area (PPA). But with innovation comes complexity, and one of the biggest challenges is ensuring silicon reliability and health through effective multi-die testing.

In this episode, we dive deep into the world of multi-die design for test: what it means, how it differs from traditional monolithic design testing, and why it’s critical for the future of semiconductor manufacturing. Learn how testing spans from individual dies to multiple dies to die-to-die links, and why silicon data is essential for maintaining multi-die health during both manufacturing and in-field operations. We will explore the future of multi-die design for test and discuss Silicon Lifecycle Management (SLM) strategies that designers can implement today to stay ahead.